论文标题
软性弹性3D网络芯片系统的可靠性评估和定量评估
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems
论文作者
论文摘要
已经提出了芯片上的三维网络（3D-NOC）作为一种吉祥的解决方案，将网络芯片（NOC）范式的高平行性与3D-ICS的高性能和低功率成本融合在一起。但是，随着技术的缩小，可靠性问题变得越来越重要，尤其是对于复杂的3D-NOC，它提供了芯片上多核系统的通信要求。在制造过程的早期阶段，可靠性评估是突出的，以防止目标系统的昂贵重新设计。在本文中，我们提出了基于软校正弹性机制的软校正弹性3D-NOC的准确可靠性评估和定量评估。系统可以从路由器的不同管道阶段发生的瞬态错误中恢复。基于此分析，确定网络主要组件中故障的影响。
Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an auspicious solution, merging the high parallelism of the Network-on-Chip (NoC) paradigm with the high-performance and low-power cost of 3D-ICs. However, as technology scales down, the reliability issues are becoming more crucial, especially for complex 3D-NoC which provides the communication requirements of multi and many-core systems-on-chip. Reliability assessment is prominent for early stages of the manufacturing process to prevent costly redesigns of a target system. In this paper, we present an accurate reliability assessment and quantitative evaluation of a soft-error resilient 3D-NoC based on a soft-error resilient mechanism. The system can recover from transient errors occurring in different pipeline stages of the router. Based on this analysis, the effects of failures in the network's principal components are determined.
