论文标题

3D-Trench硅像素的内在时间分辨率用于带电颗粒检测

Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection

论文作者

Anderlini, Lucio, Aresti, Mauro, Bizzeti, Andrea, Boscardin, Maurizio, Cardini, Alessandro, Betta, Gian-Franco Dalla, Ferrero, Marco, Forcolin, Giulio, Garau, Michela, Lai, Adriano, Lampis, Andrea, Loi, Angelo, Lucarelli, Chiara, Mendicino, Roberto, Mulargia, Roberto, Obertino, Margherita, Robutti, Enrico, Ronchin, Sabina, Ruspa, Marta, Vecchi, Stefania

论文摘要

在过去的几年中,高分辨率时间标记已成为解决下一代实验在粒子煤层的检测器中高轨道密度问题的工具。在传感器像素上的时间分辨率低于50ps,而事件平均重复速率为50 $ $ m的传感器像素是典型的最低要求。这对粒子传感器的开发和处理电子设备构成了重要的科学和技术挑战。 TimesPot计划(代表实时操作跟踪器)旨在开发适合近代粒子物理实验的粒子跟踪器的完整原型检测系统。本文介绍了基于新颖的3D MEMS(微型机电系统)设计的第一批时盘硅传感器获得的结果。遵循这种方法,同时使用了一种技术来匹配和克服其他硅传感器开发的性能,同时众所周知,该技术可抵抗辐射降解。已经在室温下测量了20PS阶的时间分辨率,这表明在进一步优化了前端电子处理阶段后,也可能改善。

In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average repetition rates of tens of MHz on sensor pixels having a pitch of 50$μ$m are typical minimum requirements. This poses an important scientific and technological challenge on the development of particle sensors and processing electronics. The TIMESPOT initiative (which stands for TIME and SPace real-time Operating Tracker) aims at the development of a full prototype detection system suitable for the particle trackers of the next-to-come particle physics experiments. This paper describes the results obtained on the first batch of TIMESPOT silicon sensors, based on a novel 3D MEMS (micro electro-mechanical systems) design. Following this approach, the performance of other ongoing silicon sensor developments has been matched and overcome, while using a technology which is known to be robust against radiation degradation. A time resolution of the order of 20ps has been measured at room temperature suggesting also possible improvements after further optimisations of the front-end electronics processing stage.

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