论文标题
日期：启用DVF中的温度侧通道攻击的防御启用MPSOC
DATE: Defense Against TEmperature Side-Channel Attacks in DVFS Enabled MPSoCs
论文作者
论文摘要
鉴于在日常生活中利用嵌入式设备的不断上升，侧渠道仍然是对此类系统中信息流控制和安全性的挑战。可以通过温度侧通道攻击来利用一个重要的安全漏洞，在这种情况下，随着时间的流逝，观察到加热元素的散热和传播，以推断出安全缺陷。在我们提出的方法论中，日期：防御温度侧通道攻击，我们提出了一种减少空间和时间热梯度的新方法，这使得该系统在温度侧通道攻击方面更加安全，同时在寿命方面提高了设备的可靠性。在本文中，我们还引入了一种新的指标，热 - 安全性处理器（TSMP），它能够量化针对计算系统的温度侧通道攻击的安全性，并且评估日期的确保为139.24％的安全性在某些应用程序中比较低的级别更高，而不是降低了67.42％的预定量，而降低了降低热量的热量。
Given the constant rise in utilizing embedded devices in daily life, side channels remain a challenge to information flow control and security in such systems. One such important security flaw could be exploited through temperature side-channel attacks, where heat dissipation and propagation from the processing elements are observed over time in order to deduce security flaws. In our proposed methodology, DATE: Defense Against TEmperature side-channel attacks, we propose a novel approach of reducing spatial and temporal thermal gradient, which makes the system more secure against temperature side-channel attacks, and at the same time increases the reliability of the device in terms of lifespan. In this paper, we have also introduced a new metric, Thermal-Security-in-Multi-Processors (TSMP), which is capable of quantifying the security against temperature side-channel attacks on computing systems, and DATE is evaluated to be 139.24% more secure at the most for certain applications than the state-of-the-art, while reducing thermal cycle by 67.42% at the most.
