论文标题

通过高通量$^{28} $ si $^ - $ ion植入硅的同位素富集

Isotopic enrichment of silicon by high fluence $^{28}$Si$^-$ ion implantation

论文作者

Holmes, D., Johnson, B. C., Chua, C., Voisin, B., Kocsis, S., Rubanov, S., Robson, S. G., McCallum, J. C., McCamey, D. R, Rogge, S., Jamieson, D. N.

论文摘要

硅28($^{28} $ si)的“半导体真空真空”中的旋转是合适的候选候选者,因为它们的相干时间很长。需要$^{28} $ si的同位素纯化的底物,以限制由$^{29} $ si核自旋(i = 1/2)引起的磁性扰动,以4.67%的含量为4.67%。我们通过使用高通量$^{28} $ SI $^ - $植入来溅射来富含Nat Si的表面层。磷(P)供体植入一个这样的$^{28} $ si层,〜3000 ppm $^{29} $ si,由30 kev $^{28} $ si $^ - $ ions植入30 kev $^{28} $ si $^ - $ ions以4x10^18 cm^-2的流动性,并以脉冲旋转量为单元,并以脉动旋转式旋转式,并取得了激活。 Hahn Echo信号的单指数衰减表明$^{29} $ SI的耗竭。提取T2 = 285 +/- 14的连贯性时间比Nat Si在类似掺杂浓度中获得的相干时间长,可以通过降低将来的P浓度来增加。通过使用45 kev $^{28} $ si $^ - $植入使用一对离子溅射来改善同位素富集。 2.63x10^18 cm^-2 $^{28} $ si $^ - $离子以这种能量植入Nat Si中,导致同位素富集的表面层〜100 nm厚;适用于植入近地表区域的供体量子位的$^{28} $ SI的足够体积。我们观察到$^{29} $ si至250 ppm的耗竭,这是通过次级离子质谱法测量的。讨论了通过固相外延的杂质含量和结晶动力学。 $^{28} $ SI层被确认为使用传输电子显微镜的单晶。这种Si同位素富集方法显示出有望纳入Si自旋量子设备的制造过程流动。

Spins in the `semiconductor vacuum' of silicon-28 ($^{28}$Si) are suitable qubit candidates due to their long coherence times. An isotopically purified substrate of $^{28}$Si is required to limit the decoherence pathway caused by magnetic perturbations from surrounding $^{29}$Si nuclear spins (I=1/2), present in natural Si (nat Si) at an abundance of 4.67%. We isotopically enrich surface layers of nat Si by sputtering using high fluence $^{28}$Si$^-$ implantation. Phosphorus (P) donors implanted into one such $^{28}$Si layer with ~3000 ppm $^{29}$Si, produced by implanting 30 keV $^{28}$Si$^-$ ions at a fluence of 4x10^18 cm^-2, were measured with pulsed electron spin resonance, confirming successful donor activation upon annealing. The mono-exponential decay of the Hahn echo signal indicates a depletion of $^{29}$Si. A coherence time of T2 = 285 +/- 14 us is extracted, which is longer than that obtained in nat Si for similar doping concentrations and can be increased by reducing the P concentration in future. The isotopic enrichment was improved by employing one-for-one ion sputtering using 45 keV $^{28}$Si$^-$ implantation. A fluence of 2.63x10^18 cm^-2 $^{28}$Si$^-$ ions were implanted at this energy into nat Si, resulting in an isotopically enriched surface layer ~100 nm thick; suitable for providing a sufficient volume of $^{28}$Si for donor qubits implanted into the near-surface region. We observe a depletion of $^{29}$Si to 250 ppm as measured by secondary ion mass spectrometry. The impurity content and the crystallization kinetics via solid phase epitaxy are discussed. The $^{28}$Si layer is confirmed to be a single crystal using transmission electron microscopy. This method of Si isotopic enrichment shows promise for incorporating into the fabrication process flow of Si spin qubit devices.

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