论文标题
温度对碳纤维增强聚合物底物上SN涂层的粘附机理通过冷喷雾剂
Adhesion mechanism of temperature effects on Sn coating on the carbon fiber reinforced polymer substrate by cold spray
论文作者
论文摘要
通过表面修饰方法将碳纤维增强聚合物（CFRP）复合材料的金属化，以增强其电导率，导热率，电磁屏蔽，侵蚀和辐射保护，在航空航天场中具有显着含义。在这项研究中，在四个气体温度（473K，523K，573K和623K）下，通过低压冷喷雾成功地在CFRP复合基板上成功制造了SN涂层。通过表面温度分布研究，通过剥离粘附强度后的表面观察来探索它们的粘结机制。结果表明，我们无法在623 K处获得涂层，CFRP底物的环氧基质在523 K以上的沉积过程中逐渐侵蚀。与此同时，SN颗粒在623 K条件下融化。三种界面：SN/环氧树脂，SN/CF和SN/CF/环氧树脂作为相对于不同气温的特征，以探索粘结机制。
Metalization of carbon fiber reinforced polymers (CFRPs) composites by the surface modification method to enhance their electrical conductivity, thermal conductivity, electromagnetic shielding, erosion, and radiation protection, has a significant meaning in the aerospace field. In this study, Sn coating was successfully fabricated on the CFRP composite substrate via low-pressure cold spray under four gas temperatures (473K, 523K, 573K, and 623K). Their bonding mechanism was explored via the surface observation after peel-off adhesion strength, accompanying with surface temperature distribution investigation. The results indicates that we cannot obtain coating at 623 K, the epoxy matrix of the CFRP substrate was gradually eroded during deposition over 523 K. Meanwhile, Sn particles melt under 623 K condition. Three kinds of interfaces: Sn/epoxy, Sn/CF, and Sn/CF/epoxy are revealed as characteristics with respect to different gas temperatures to explore the bonding mechanisms.
