论文标题
低成本和无毒的核心壳Cu@cu2o纳米复合材料中的超速导热率和大量的优点
Ultralow Thermal Conductivity and Large Figure of Merit in Low-Cost and Nontoxic Core-Shell Cu@Cu2O Nanocomposites
论文作者
论文摘要
用增强的热电（TE）性能鉴定新型材料对于推进TE研究至关重要。在这个方向上，这是关于低成本，无毒和丰富的核心壳Cu@Cu2O纳米复合材料（NCS）的第一份报告，该报告使用易于且廉价的溶液 - 相位方法合成。它们显示了近10-3个铜散装值的超动热电导率，大型热电器〜0.373 MVK-1，因此，在320 K时的优点（ZT）为0.16的TE te型，比许多潜在的TE材料（例如PBTE，SNSE和SIGE）大的材料大于TE应用。超动导热性主要归因于Cu2O，晶界（GBS），晶格不匹配的界面以及不同振动特性的固有缺陷的多尺度声子散射。大型热电器与CU和CU2O纳米颗粒（NP）和载体能量滤波之间的电荷转移引起的状态载体密度（DOS）的急剧调制有关。
Identification of novel materials with enhanced thermoelectric (TE) performance is critical for advancing TE research. In this direction, this is the first report on TE properties of low-cost, nontoxic, and abundant core-shell Cu@Cu2O nanocomposites (NCs) synthesized using a facile and cheap solution-phase method. They show ultralow thermal conductivity of nearly 10-3 of copper bulk value, large thermopower ~0.373 mVK-1, and consequently, a TE figure of merit (ZT) of 0.16 at 320 K which is larger than those of many of the potential TE materials such as PbTe, SnSe and SiGe, showing its potential for TE applications. The ultralow thermal conductivity is mainly attributed to the multiscale phonon scattering from intrinsic defects in Cu2O, grain boundaries (GBs), lattice-mismatched interface as well as dissimilar vibrational properties. The large thermopower is associated with sharp modulation in carrier density of states (DOS) due to charge transfer between Cu and Cu2O nanoparticles (NPs), and carrier energy filtering.
