论文标题
限制电子梁从含有表面活性剂的水溶液中诱导铜沉积的机制
Limiting Regimes for Electron-Beam Induced Deposition of Copper from Aqueous Solutions Containing Surfactants
论文作者
论文摘要
近年来，聚焦电子束从水溶液中引起的纯材料沉积引起了人们的关注。但是，在部分真空中控制液体膜是具有挑战性的。在这里，我们修改底物以增加对液体层的控制，以便对环境SEM中的铜沉积进行参数研究。我们确定了从电子到质量传输有限沉积的过渡，以及两个以汇总和高度比率沉积物为特征的其他制度。我们观察到每个原代电子的高沉积效率为1至10个铜原子，这与沉积过程的辐射化学模型一致。
Focused electron beam induced deposition of pure materials from aqueous solutions has been of interest in recent years. However, controlling the liquid film in partial vacuum is challenging. Here we modify the substrate to increase control over the liquid layer in order to conduct a parametric study of copper deposition in an environmental SEM. We identified the transition from electron to mass-transport limited deposition as well as two additional regimes characterized by aggregated and high-aspect ratio deposits. We observe a high deposition efficiency of 1 to 10 copper atoms per primary electron that is consistent with a radiation chemical model of the deposition process.
