论文标题

软五角大楼组件压实的微机械描述

Micromechanical description of the compaction of soft pentagon assemblies

论文作者

Cárdenas-Barrantes, Manuel, Cantor, David, Barés, Jonathan, Renouf, Mathieu, Azéma, Emilien

论文摘要

我们通过数值模拟分析了由经典库仑摩擦相互作用的软五边形组成的组件的各向同性压实。通过比较五角孔的包装与软圆形颗粒的包装来讨论初始粒子形状的效果。我们表征了包装分数,弹性模量和微结构(粒子重排,连通性,接触力和粒子应力分布)的演变,这是所施加的应力的函数。这两个系统的行为类似。填料分数增加并渐近地趋向于最大值$ ϕ_ {max} $,其中散装模量差异。在微观量表上,我们表明粒子重排甚至超出了堵塞状态,平均配位作为堆积分数的平方根增加,并且随着堆积分数的增加,力和应力分布变得更加均匀。软五角大龙比圆形的颗粒重排更大,并且这种行为与摩擦成比例地减少。有趣的是,颗粒之间的摩擦还有助于在两个系统中更好地均质化接触力网络。从颗粒应力张量的表达来看,我们开发了一个模型,该模型将压实行为描述为施加压力,年轻模量和颗粒的初始形状的函数。该模型定居在粒子连接性和接触应力的关节演化上,从干扰点到非常高的密度提供了出色的预测。

We analyze the isotropic compaction of assemblies composed of soft pentagons interacting through classical Coulomb friction via numerical simulations. The effect of the initial particle shape is discussed by comparing packings of pentagons with packings of soft circular particles. We characterize the evolution of the packing fraction, the elastic modulus, and the microstructure (particle rearrangement, connectivity, contact force and particle stress distributions) as a function of the applied stresses. Both systems behave similarly; the packing fraction increases and tends asymptotically to a maximum value $ϕ_{max}$, where the bulk modulus diverges. At the microscopic scale we show that particle rearrangements occur even beyond the jammed state, the mean coordination increases as a square root of the packing fraction and, the force and stress distributions become more homogeneous as the packing fraction increases. Soft pentagons present larger particle rearrangements than circular ones, and such behavior decreases proportionally to the friction. Interestingly, the friction between particles also contributes to a better homogenization of the contact force network in both systems. From the expression of the granular stress tensor, we develop a model that describes the compaction behavior as a function of the applied pressure, the Young modulus and the initial shape of the particles. This model, settled on the joint evolution of the particle connectivity and the contact stress, provides outstanding predictions from the jamming point up to very high densities.

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