论文标题

DF RF CCP放电的虚拟IED传感器

Virtual IED sensor for df rf CCP discharges

论文作者

Bogdanova, M., Lopaev, D., Rakhimova, T., Voloshin, D., Zotovich, A., Zyryanov, S.

论文摘要

离子辅助表面过程是现代血浆处理的基础。离子能量分布(IED)控制对于精确的材料修饰至关重要,尤其是在原子级技术(例如原子层蚀刻)中。由于该控件应实时完成,因此需要使用快速过程传感器实时反馈。在通常的工业等离子体反应器的一般情况下,如果不可能进行直接的IED测量,则可以使用虚拟IED传感器的概念来估算IED。在本文中,以非对称双频(DF)RF CCP放电为例,考虑使用类似的虚拟IED传感器。它基于在RF偏置电极下的IED快速计算方法。该方法将实验测量的鞘电压波形和等离子体密度(或离子通量)作为输入数据,还包括鞘中的离子运动的蒙特卡罗模拟,以考虑离子中性碰撞的效果。为了验证这种方法,使用多种气体中的各种血浆诊断进行了实验:氩气和氙气作为具有原子离子和氮的血浆示例,作为分子离子等离子体的示例。结果表明,在所有情况下,都可以在相当短的时间内获得足够的IED估计,接近实验性估计(使用现代PC时〜几秒钟)。获得的结果证明了在实际等离子体处理中使用虚拟IED传感器的可能性。

Ion-assisted surface processes are the basis of modern plasma processing. Ion energy distribution (IED) control is critical for precise material modification, especially in atomic-level technologies such as atomic layer etching. Since this control should be done in real time, it requires real-time feedback using fast process sensors. In the general case of an industrial plasma reactor, when direct IED measurement is not possible, the IED can be estimated using the concept of a virtual IED sensor. In this paper, a similar virtual IED sensor is considered using an asymmetric dual-frequency (df) rf CCP discharge as an example. It is based on a fast calculation method of the IED at an rf-biased electrode. This approach uses the experimentally measured sheath voltage waveform and plasma density (or ion flux) as input data, and also includes Monte-Carlo simulation of ion motion in the sheath to take into account the effect of ion-neutral collisions. To validate this approach, experiments were carried out using various plasma diagnostics in several gases: argon and xenon as examples of plasma with atomic ions and nitrogen as an example of plasma with molecular ions. It is shown that in all cases it is possible to obtain an adequate IED estimation, close to the experimental one, in a reasonably short time (~ tens of seconds when using a modern PC). The results obtained demonstrate the possibility of using a virtual IED sensor in real plasma processing.

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