论文标题
无机立方FRBX3的结构,弹性和光电特性(b = ge,sn; x = cl,br,i)钙钛矿:密度功能理论方法
Structural, elastic and optoelectronic properties of inorganic cubic FrBX3 (B = Ge, Sn; X = Cl, Br, I) perovskite: the density functional theory approach
论文作者
论文摘要
无机金属壁的立方钙钛矿半导体在光伏和光电设备的工业应用中变得越来越流行。在各种钙钛矿中,由于其对环境的无毒作用,目前最不含铅的材料。在这项研究中,通过第一原理密度官能理论(DFT)计算研究了无铅立方钙钛矿材料FRBX3(b = ge,sn; x = cl,b,i)的结构,电子,光学和机械性能。发现这些材料具有直接带隙能和机械相稳定性的半导体行为。基于阳离子和坐落在FRBX3化合物的B和X线的阳离子和阴离子的取代的带隙中观察到的变化。高吸收系数,低反射率和高光学电导率使这些材料适用于光伏和其他光电设备的应用。可以观察到,与含有SN的材料相比,B位中包含GE(锗)的材料具有更高的光吸收和电导率。对电子,光学和机械性能的系统分析表明,在所有钙钛矿材料中,FRGEI3将是光电应用的潜在候选者。含有放射性元素FR的钙钛矿FRGEI3可能在核医学和诊断中应用,例如X射线成像技术。
Inorganic metal-halide cubic perovskite semiconductors have become more popular in industrial applications of photovoltaic and optoelectronic devices. Among various perovskites, lead-free materials are currently most explored due to their non-toxic effect on the environment. In this study, the structural, electronic, optical, and mechanical properties of lead-free cubic perovskite materials FrBX3 (B = Ge, Sn; X = Cl, Br, I) are investigated through first-principles density-functional theory (DFT) calculations. These materials are found to exhibit semiconducting behavior with direct bandgap energy and mechanical phase stability. The observed variation in the bandgap is explained based on the substitutions of cations and anions sitting over B and X-sites of the FrBX3 compounds. The high absorption coefficient, low reflectivity, and high optical conductivity make these materials suitable for photovoltaic and other optoelectronic device applications. It is observed that the material containing Ge (germanium) in the B-site has higher optical absorption and conductivity than Sn containing materials. A systematic analysis of the electronic, optical, and mechanical properties suggests that among all the perovskite materials, FrGeI3 would be a potential candidate for optoelectronic applications. The radioactive element Fr-containing perovskite FrGeI3 may have applications in nuclear medicine and diagnosis such as X-ray imaging technology.