论文标题
大型行业参与受益的HEP：大型CAD公司的微电子支持
Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies
论文作者
论文摘要
微电子的开发对于大量的DOE项目和任务空间至关重要。创建有用的激励措施来生产半导体（芯片）和制造应用程序特定的集成电路（ASIC）对DOE很重要，因此允许DOE执行其任务的基础架构必须存在。本文讨论了当前的举措，并建议采用商业模型来为DOE建立生态系统，其中包括三个主要构件：计算机辅助设计（CAD） - 电子设计自动化（EDA）设计工具，基本设计IPS，以及对半导体制造设施的访问。
Microelectronics development is critical to a wide number of DOE projects and mission space. Creating Helpful Incentives to Produce Semiconductors (CHIPS) and manufacturing Application Specific Integrated Circuits (ASIC) are important to DOE, so the infrastructure that allows DOE to carry out its mission needs to exist. This paper discusses the current initiatives and recommends a business model to build an ecosystem for microelectronics design for DOE which includes three main building blocks: the Computer Aided Design (CAD) - Electronic Design Automation (EDA) design tools, basic design IPs, and access to semiconductor fabrication facilities.
