论文标题
使用金属网格接触的电绝缘环境中Al键垫的AES分析
AES Analysis of Al Bond Pads in Electrically Insulating Surroundings Utilizing Metal Grid Contacting
论文作者
论文摘要
粘结垫是与外界的微电器设备的电气互连。微电子设备顶部的聚酰亚胺层（PI）可保护整个设备免受环境影响。键垫是可以在此绝缘层中的开口来访问的。 Al键垫表面的氧化层厚度和污染物以及粘结线和粘结线之间的机械和电关节的质量，作为该互连的耐用性。如果必须使用高空间分辨率螺旋钻电子光谱法（AES）分析键垫表面是选择的方法。 AES利用电子束进行激发，这会导致由于PI层而引起严重的样品充电。可以通过金属网格避免样品充电，这在透射电子显微镜（TEM）样品制备中常见。将TEM网格按在样品上，而感兴趣的粘结垫则集中在网格的正方形开口中。对键垫的示例分析证明了这种方法在AES测量中的适用性。
Bond pads are the electrical interconnections of a microelectronic device to the outside world. A polyimide layer (PI) on top of a microelectronic device protects the whole device against environmental impacts. The bond pads are accessible though openings in this electrically insulating layer. The oxide layer thickness and contaminations at the Al bond pad surface influence as well the quality of the mechanical and electrical joint between bond pad and bond wire as the durability of this interconnection. If a bond pad surface has to be analyzed with high spatial resolution Auger electron spectroscopy (AES) is the method of choice. AES utilizes an electron beam for excitation, which induces serious sample charging because of the PI layer. Sample charging can be avoided by metal grids, which are common in transmission electron microscopy (TEM) sample preparation. A TEM grid is pressed onto the sample while the bond pad of interest is centered in the square openings of the grid. Exemplarily analyses of bond pads demonstrate the applicability of this approach for AES measurements.
