论文标题
通过引入原子缺陷的WSE2的热导率的强烈降低
Strong Reduction of Thermal Conductivity of WSe2 with Introduction of Atomic Defects
论文作者
论文摘要
通过使用平衡分子动力学方法研究了原始和有缺陷的Dungsten diselenide(WSE2)的热电导率。 WSE2的热导率急剧增加,大小低于一个特征,左右为〜5 nm,对于更广泛的样品而言,水平关闭,恒定值约为2 w/mk。通过引入原子空位,我们发现WSE2的热导率显着降低。特别是,与SE空位相比,W空位对降低导热率的影响更大:原始WSE2的导热率分别降低了约60%和约70%,分别增加了约1%的SE和W空位。发现导热率的降低与有缺陷的WSE2中声子平均自由路径(MFP)的减少有关。 WSE2的MFP从省长WSE2降低到〜2.2 nm,增加了0.9%SE空位。除了单个空缺外,还探索了更复杂的点缺陷类型,例如空位簇和反位点缺陷,并发现可以极大地重新赋予声子。键的重建导致状态的声子密度的禁止缝隙中的局部声子,从而导致热传导的下降。这项工作证明了不同缺陷对单层WSE2导热率的影响,从而洞悉了缺陷诱导的声子传输过程,以及改善基于WSE2的电子设备中的热量耗散的方法。
The thermal conductivities of pristine and defective tungsten diselenide (WSe2) are investigated by using equilibrium molecular dynamics method. The thermal conductivity of WSe2 increases dramatically with size below a characteristic with of ~ 5 nm and levels off for broader samples and reaches a constant value of ~2 W/mK. By introducing atomic vacancies, we discovered that the thermal conductivity of WSe2 is significantly reduced. In particular, the W vacancy has a greater impact on thermal conductivity reduction than Se vacancies: the thermal conductivity of pristine WSe2 reduced by ~60% and ~70% with the adding of ~1% of Se and W vacancies, respectively. The reduction of thermal conductivity is found to be related with the decrease of mean free path (MFP) of phonons in the defective WSe2. The MFP of WSe2 decreases from ~4.2 nm for prefect WSe2 to ~2.2 nm with the adding of 0.9% Se vacancies. More sophisticated types of point defects, such as vacancy clusters and anti-site defects, are explored in addition to single vacancies, and are found to dramatically renormalize the phonons. The reconstruction of the bonds leads to localized phonons in the forbidden gap in the phonon density of states which leads to the drop of thermal conduction. This work demonstrates the influence of different defects on thermal conductivity of single-layer WSe2, providing insight into the process of defect-induced phonon transport as well as ways to improve heat dissipation in WSe2-based electronic devices.