论文标题

低压驱动铁电设备的超薄ALSCN

Ultrathin AlScN for low-voltage driven ferroelectric-based devices

论文作者

Schönweger, Georg, Islam, Md Redwanul, Wolff, Niklas, Petraru, Adrian, Kienle, Lorenz, Kohlstedt, Hermann, Fichtner, Simon

论文摘要

铁电性在ALSCN中的厚度缩放是其在神经形态计算和记忆设备中的潜在应用的决定因素。在这封信中,我们报告了超薄(10 nm)AL0.72SC0.28N胶片,这些胶片是在室温下可切换的。通过磁铁溅射到GAN/SAPPHIRE底物上,然后采用原位PT上限方法来避免AL0.72SC0.28N膜表面氧化,然后采用了原位PT封盖方法,从而生长了全部外皮AL0.72SC0.28N/PT异质结构。 X射线衍射和透射电子显微镜的结构表征揭示了已建立的外观。这样获得的高质量界面与原位封端结合在一起,有望促进超薄状态下ALSCN的铁电交换。对AL0.72SC0.28N膜厚度的相对介电常数和强制场的依赖性在100 nm至10 nm的范围内的分析仅表明中等缩放效应,这表明尚未接近铁电性的临界厚度。此外,沉积的层堆栈证明了使用溅射沉积技术将超薄铁电ALSCN纳入全部图基的设备的可能性。因此,我们的工作突出了全部外皮超薄ALSCN的集成和缩放潜力,提供了高储物密度,并配对了最先进的铁电记忆设备所需的低压操作。

Thickness scaling of ferroelectricity in AlScN is a determining factor for its potential application in neuromorphic computing and memory devices. In this letter, we report on ultrathin (10 nm) Al0.72Sc0.28N films that are ferroelectrically switchable at room temperature. All-epitaxial Al0.72Sc0.28N/Pt heterostructures are grown by magnetron sputtering onto GaN/sapphire substrates followed by an in situ Pt capping approach to avoid oxidation of the Al0.72Sc0.28N film surface. Structural characterization by X-ray diffraction and transmission electron microscopy reveals the established epitaxy. The thus obtained high-quality interfaces in combination with the in situ capping is expected to facilitate ferroelectric switching of AlScN in the ultrathin regime. The analysis of the relative permittivity and coercive field dependence on the Al0.72Sc0.28N film thicknesses in the range of 100 nm down to 10 nm indicates only moderate scaling effects, suggesting that the critical thickness for ferroelectricity is not yet approached. Furthermore, the deposited layer stack demonstrates the possibility of including ultrathin ferroelectric AlScN into all-epitaxial GaN-based devices using sputter deposition techniques. Thus, our work highlights the integration and scaling potential of all-epitaxial ultrathin AlScN offering high storage density paired with low voltage operation desired for state of the art ferroelectric memory devices.

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