论文标题
具有多个波导层的光子积分电路，用于宽带高效的片上3-D光学分阶段阵列，并在光检测和范围应用中
Photonic integrated circuit with multiple waveguide layers for broadband high-efficient on-chip 3-D optical phased arrays in light detection and ranging applications
论文作者
论文摘要
传统的光子集成电路（PIC）继承了电子集成电路（IC）行业的成熟CMOS制造过程。但是，此过程还将PIC结构限制为单波导层配置。在这项工作中，我们通过提出和演示一个真正的3-D光学阶段阵列（OPA）设备来探索多波导层PIC的可能性，并基于多层SI3N4/SIO2平台，光线从设备的边缘退出。多波导层配置提供了在输入和发射端都利用边缘耦合器来实现宽带高效率的可能性。这种独特性为LiDAR应用程序中更扩展的检测范围提供了潜力。该设备已通过数值模拟研究，并已通过CMOS兼容过程制造并测试了概念验证样品。据我们所知，这是整个设备上具有多波导指导层配置的真实3-D OPA的第一个实验概念证明。
Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration. In this work, we explore the possibility of the multi-waveguide-layer PIC by proposing and demonstrating a true 3-D optical phased array (OPA) device, with the light exiting from the edge of the device, based on a multi-layer Si3N4/SiO2 platform. The multi-waveguide-layer configuration offers the possibility of utilizing edge couplers at both the input and the emitting ends to achieve broadband high efficiency. This uniqueness provides the potential for a more extended detection range in the Lidar application. The device has been studied by numerical simulation, and proof-of-concept samples have been fabricated and tested with a CMOS-compatible process. To the best of our knowledge, this is the first experimental proof-of-concept of a true 3-D OPA with a multi-waveguide-layer configuration all over the device.
