论文标题
单光子应用的低损坏氮化硅光子IC
Low-loss silicon nitride photonic ICs for single-photon applications
论文作者
论文摘要
低损坏光子综合电路(图片)是未来量子技术,非线性光子学和神经网络的关键要素。靶向C波段应用的低损耗光子电路技术在多项目晶圆(MPW)晶圆厂中建立了很好的确定,而近红外(NIR)图片适用于最先进的单光子源,但仍未开发。在这里,我们报告了实验室规模的过程优化和用于单光子应用的低功能光子积分电路的光学表征。我们证明了在单模氮化硅亚微米波导(220x550 nm)中的日期(在925 nm波长下低至0.55 db/cm)的最低传播损失。由于先进的电子束光刻和感应耦合的血浆反应离子蚀刻步骤,因此实现了这种性能,该步骤产生波导的垂直侧壁,侧面侧壁降至0.85 nm。这些结果提供了一个芯片尺度的低损失图片平台,可以通过高质量的SIO2覆层,化学机械抛光和多步式退火来进一步改善,以实现术后单打的单光子应用。
Low-loss photonic integrated circuits (PICs) are the key elements in future quantum technologies, nonlinear photonics and neural networks. The low-loss photonic circuits technology targeting C-band application is well established across multi-project wafer (MPW) fabs, whereas near-infrared (NIR) PICs suitable for the state-of-the-art single-photon sources are still underdeveloped. Here, we report the labs-scale process optimization and optical characterization of low-loss tunable photonic integrated circuits for single-photon applications. We demonstrate the lowest propagation losses to the date (as low as 0.55 dB/cm at 925 nm wavelength) in single-mode silicon nitride submicron waveguides (220x550 nm). This performance is achieved due to advanced e-beam lithography and inductively coupled plasma reactive ion etching steps which yields waveguides vertical sidewalls with down to 0.85 nm sidewall roughness. These results provide a chip-scale low-loss PIC platform that could be even further improved with high quality SiO2 cladding, chemical-mechanical polishing and multistep annealing for extra-strict single-photon applications.