论文标题

基于电镀的等离子纳米棒超材料用于生物传感应用的工程

Electroplating based engineering of plasmonic nanorod metamaterials for biosensing applications

论文作者

Sahoo, Mihir Kumar, VS, Abhay Anand, Kumar, Anshuman

论文摘要

使用无标签的生物传感器在稀释溶液中感测较低的分子量是有挑战性的,需要微型的等离子结构,例如,基于垂直的Au nanorod(Aunr)基于基于的阵列的超材料。传感器的灵敏度主要取决于传感器的性质,因此,Aunr阵列几何形状需要优化。物理蒸气沉积方法(例如,溅射和电子束蒸发)需要真空环境沉积Au,这是昂贵,耗时且厚度限制的。另一方面,化学沉积,即,在更少的时间和成本较低的情况下,电镀沉积物厚度更高,成为AU沉积的另一种方法。在这项工作中,我们为这些超材料的基于电镀的制造提供了详细的优化。我们发现略微酸性(6.0 <pH <7.0)金亚硫酸盐溶液支持浸入沉积,应将其最小化以避免不受控制的AU沉积。浸入沉积会导致板状(对于较小的半径aunr)或类似盖的样子,即蘑菇(对于较高的半径aunr)结构的形成。电镀时间和直流电源是在依赖面积依赖性电镀沉积中确定垂直排列Aunr阵列的几何形状的调谐参数。这项工作将对开发基于等离子材料的传感器有影响。

Sensing lower molecular weight in a diluted solution using a label-free biosensor is challenging and requires a miniaturized plasmonic structure, e.g., a vertical Au nanorod (AuNR) array based metamaterials. The sensitivity of a sensor mainly depends on transducer properties and hence for instance, the AuNR array geometry requires optimization. Physical vapour deposition methods (e.g., sputtering and e-beam evaporation) require a vacuum environment to deposit Au, which is costly, time-consuming, and thickness-limited. On the other hand, chemical deposition, i.e., electroplating deposit higher thickness in less time and at lower cost, becomes an alternative method for Au deposition. In this work, we present a detailed optimization for electroplating based fabrication of these metamaterials. We find that slightly acidic (6.0 < pH < 7.0) gold sulfite solution supports immersion deposition, which should be minimized to avoid uncontrolled Au deposition. Immersion deposition leads to plate-like (for smaller radius AuNR) or capped-like, i.e., mushroom (for higher radius AuNR) structure formation. The electroplating time and DC supply are the tuning parameters that decide the geometry of the vertically aligned AuNR array in area-dependent electroplating deposition. This work will have implications for developing plasmonic metamaterial based sensors.

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